Hi visitor! I am Ronghua Li (李镕骅,or call me Cory), currently a postdoctoral researcher at NAISS lab. I finished my PhD at the Hong Kong Polytechnic University, advised by Prof. Haibo Hu. During my Ph.D., I joined the NOISE lab as a visiting student at UChicago, advised by Nick Feamster. I got my master’s degree from KTH, Sweden, advised by Panos Papadimitratos. My main research focuses on network data modeling and their security/privacy implications, LLM data analysis and synthesis. I’m very open to AI/network/security collaborations; feel free to reach out to me via email or WeChat (lrh893304167)!

🔥 News

  • 2026.05.10:  🎉🎉 Our Mobius-Injection paper was accepted to NDSS 2027! Thanks to Zi for involving me into the project!!
  • 2026.05.10:  🎉🎉 Our MAppPrint paper was accepted to NDSS 2027! Huge congrats to Tao!!
  • 2026.05.10:  🎉🎉 Our PaCR paper was accepted!
  • 2026.05.08:  🎓 Successfully defended my dissertation!
  • 2025.12.06:  🎉🎉 Finally launched my personal page!
  • 2025.12.03:  🎉🎉 Our paper got accepted to NDSS 2026!

📝 Publications (Chronological)

Preprint/Submitted

  • BFM Witnessing: Securing Wi-Fi Against Forged Beamforming Feedback Manipulation (submitted to TIFS)
    Zhibiao Guo, Ronghua Li, Youqian Zhang, Qingqing Ye, Jiang Zhu, Haibo Hu
  • “Keep Alert!”” Exploiting Wi-Fi Beamforming Announcement for Traffic Disruption and Power Drain (submitted to NDSS)
    Zhibiao Guo, Ronghua Li, Youqian Zhang, Qingqing Ye, Haibo Hu

🎖 Honors and Awards

  • 2024.12 Received RSAP scholarship for my visiting program.

🖊️ Services

Conference Reviewer

  • ICASSP 26, 27; ICLR 27;

Journal Reviewer

  • IEEE Transactions on Dependable and Secure Computing
  • IEEE Internet of Things Journal
  • Journal of Internet Technology
  • Journal of Cybersecurity and Privacy

📖 Educations

  • 2022.09 - 2026.08, The Hong Kong Polytechnic University, EIE, Ph.D.
  • 2019.09 - 2022.03, KTH Royal Institute of Technology, COMM, M.S.
  • 2016.09 - 2020.06, Huazhong University of Science and Technology, B.E.

💻 Experiences

  • 2026.05 - 2025.08, Intern @Huawei, Dongguan, Guangdong, China.
  • 2025.01 - 2025.07, Visiting Student @Uchicago, Chicago, Illinois, U.S.
  • 2020.06 - 2020.09, Android developer @Meituan, Beijing, China.